Semiconductor memory cards and method of making same

US6624005B1 · kind B1 · utility

Assignee

• Amkor Technology, Inc. · US

Inventors

• Vincent DiCaprio · Pleasanton, US
• Kenneth Kaskoun · Berlin, DE

Key dates

• Filing date: Sep 6, 2000
• Grant date: Sep 23, 2003
• Expiry date: Sep 6, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19105
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Alternative methods for making memory cards for computers and such eliminate a need for a separate external housing and a separate chip encapsulation step and enable more memory to be packaged in a same-sized card. One of said methods includes providing a substrate having opposite first and second surfaces with a memory chip mounted on and in electrical connection with a first surface of said substrate. Said second surface of said substrate is temporarily attached to a first surface of a flat carrier sheet, e.g., an adhesive tape. In one embodiment, a mold having a cavity therein is placed on said first surface of said carrier sheet such that said chip and said first surface of said substrate are enclosed in said cavity between said mold and said carrier sheet. A fluid plastic is introduced into said cavity and cured to encapsulate said chip and at least said first surface of said substrate in a protective, monolithic body of hardened plastic. A completed card is then detached from said carrier sheet.