Die attach back grinding
US6624048B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2001 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Jan 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for constructing a number of integrated circuits from a single substrate is provided by the present invention. A number of integrated circuits are constructed on the single substrate. The individual integrated circuits are then separated by cutting the substrate with a dicing saw. A vacuum chuck is used to grasp the individual integrated circuits while a back grinding process is performed on the individual circuits to polish the circuits to a predetermined thickness. The integrated circuits are then placed into integrated circuit packages. By performing the back grinding process after the substrate has been divided into the separate individual circuits, the present invention eliminates the need to back grind portions of the substrate that are not further used, and tends to eliminate handling of the fragile thinned substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.