Miniature semiconductor package for opto-electronic devices
US6624507B1 · kind B1 · utility
32Cited by
27References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2001 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Aug 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention pertains to using a leadless leadframe package as the semiconductor device package component of an opto-electronic combinational device. Leadless leadframe packages (LLPs) have very small form factors that allow an opto-electronic device to also have a small overall form factor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.