Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing
US6626196B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2001 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Dec 1, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An arrangement and method for the degassing small high-aspect ratio drilled holes or vias which are present in panels such as printed circuit boards prior to wet chemical processing, including copper plating of the vias, in order to remove any air or gas bubbles from the vias tending to inhibit the reliable plating thereof. This is carried out through the utilization of an ultrasonic prewetting in a liquid bath preceding cleaning for the electroless plating process, thereby enabling all of the vias or holes to be degassed; in effect, having air removed and the vias or holes filled with liquid; thereby allowing subsequent process cleansing solutions to easily flow into the respective holes or vias in order to facilitate the electroless copper plating process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.