Electroplating apparatus with vertical electrical contact
US6627052B2 · kind B2 · utility
30Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2000 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Dec 12, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrodeposition apparatus for depositing material on a surface of a substrate. The electrodeposition apparatus includes at least one contact for vertically contacting the substrate and providing electrical connection to the substrate. The at least one contact does not scratch the surface of the substrate to be plated. A voltage source is connected to the at least one contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.