Peter S. Locke
17Patents
8h-index
44Co-inventors
64Inventor score
Filing activity: Jul 30, 1999 → Mar 29, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6270646A | Electroplating apparatus and method using a compressible contact | Chemistry; Metallurgy | 50 | Expired |
| US6333120A | Method for controlling the texture and microstructure of plated copper and plated structure | Emerging Cross-Sectional Technologies | 36 | Expired |
| US6627052B2 | Electroplating apparatus with vertical electrical contact | Chemistry; Metallurgy | 30 | Expired |
| US6344129B1 | Method for plating copper conductors and devices formed | Electricity | 29 | Expired |
| US6368484B1 | Selective plating process | Electricity | 29 | Expired |
| US6471845B1 | Method of controlling chemical bath composition in a manufacturing environment | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6344125B1 | Pattern-sensitive electrolytic metal plating | Electricity | 22 | Expired |
| US6413854B1 | Method to build multi level structure | Electricity | 22 | Expired |
| US6331237A | Method of improving contact reliability for electroplating | Chemistry; Metallurgy | 4 | Expired |
| US6258717A | Method to produce high quality metal fill in deep submicron vias and lines | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6592747B2 | Method of controlling additives in copper plating baths | Physics | 3 | Expired |
| US6660330B2 | Method for depositing metal films onto substrate surfaces utilizing a chamfered ring support | Electricity | 3 | Expired |
| US6979393B2 | Method for plating copper conductors and devices formed | Electricity | 0 | Expired |
| US7678258B2 | Void-free damascene copper deposition process and means of monitoring thereof | Chemistry; Metallurgy | 0 | Active |
| US7078247B2 | Early detection of contact liner integrity by chemical reaction | Emerging Cross-Sectional Technologies | 0 | Expired |
| US7227265B2 | Electroplated copper interconnection structure, process for making and electroplating bath | Chemistry; Metallurgy | 0 | Expired |
| US6600230B2 | Seedlayer for plating metal in deep submicron structures | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.