Positive photosensitive poliymide composition
US6627377B1 · kind B1 · utility
87Cited by
3References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2000 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Jun 26, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/106
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive polyimide composition which is soluble in an organic solvent, which is excellent in adhesiveness, heat resistance, mechanical properties and flexibility, which shows the property of highly sensitive positive-type photoresist that is soluble in alkali upon irradiation with light is disclosed. The polyimide composition of the present invention contains a photoacid generator and a solvent-soluble polyimide which shows positive-type photosensitivity in the presence of said photoacid generator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.