Method for mounting an electronic component
US6627483B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1999 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Mar 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09472
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for mounting an electronic component. In one example of this method, the electronic component is an integrated circuit which is placed against an element of a carrier, such as a frame of a carrier. The electronic component has a plurality of elongate, resilient, electrical contact elements which are mounted on a corresponding first electrical contact pads on the electronic component. The electronic component is secured to the carrier, aNd the carrier is pressed against a first substrate having a plurality of second electrical contacts on a surface of the first substrate. In a typical example of this method, the electronic component is an integrated circuit which is being tested while being held in a carrier. The integrated circuit has been singulated from a wafer containing a plurality of integrated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.