David V. Pedersen
56Patents
33h-index
22Co-inventors
88Inventor score
Filing activity: Jun 23, 1994 → Aug 11, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6064213A | Wafer-level burn-in and test | Electricity | 278 | Expired |
| US6184053A | Method of making microelectronic spring contact elements | Electricity | 225 | Expired |
| US5998864A | Stacking semiconductor devices, particularly memory chips | Emerging Cross-Sectional Technologies | 215 | Expired |
| US6043563A | Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals | Electricity | 191 | Expired |
| US6690185B1 | Large contactor with multiple, aligned contactor units | Physics | 173 | Expired |
| US6429029B1 | Concurrent design and subsequent partitioning of product and test die | Electricity | 173 | Expired |
| US6644982B1 | Method and apparatus for the transport and tracking of an electronic component | Electricity | 147 | Expired |
| US6330164A | Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device | Emerging Cross-Sectional Technologies | 138 | Expired |
| US5675180A | Vertical interconnect process for silicon segments | Emerging Cross-Sectional Technologies | 135 | Expired |
| US6456099B1 | Special contact points for accessing internal circuitry of an integrated circuit | Electricity | 134 | Expired |
| US6640415B2 | Segmented contactor | Emerging Cross-Sectional Technologies | 121 | Expired |
| US6033935A | "Sockets for ""springed"" semiconductor devices" | Emerging Cross-Sectional Technologies | 115 | Expired |
| US6627483B2 | Method for mounting an electronic component | Electricity | 113 | Expired |
| US6525555B1 | Wafer-level burn-in and test | Electricity | 105 | Expired |
| US6825052B2 | Test assembly including a test die for testing a semiconductor product die | Electricity | 92 | Expired |
| US6534856B1 | Sockets for “springed” semiconductor devices | Emerging Cross-Sectional Technologies | 91 | Expired |
| US6621260B2 | Special contact points for accessing internal circuitry of an integrated circuit | Electricity | 81 | Expired |
| US6232149A | "Sockets for ""springed"" semiconductor devices" | Emerging Cross-Sectional Technologies | 80 | Expired |
| US6727580B1 | Microelectronic spring contact elements | Electricity | 80 | Expired |
| US6766348B1 | Method and system for load-balanced data exchange in distributed network-based resource allocation | Physics | 80 | Expired |
| US6788094B2 | Wafer-level burn-in and test | Electricity | 79 | Expired |
| US6597187B2 | Special contact points for accessing internal circuitry of an integrated circuit | Electricity | 79 | Expired |
| US6215196A | Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals | Electricity | 76 | Expired |
| US6603324B2 | Special contact points for accessing internal circuitry of an integrated circuit | Electricity | 73 | Expired |
| US6664628B2 | Electronic component overlapping dice of unsingulated semiconductor wafer | Electricity | 71 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.