Ferroelectric thin film capacitors having multi-layered crystallographic textures
US6627930B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2000 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Mar 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/684
Abstract
A ferroelectric thin film capacitor and a method for producing the same wherein the capacitor dielectric includes multi-layered crystallographic textures. An integrated circuit device, such as a non-volatile memory device, includes at least one capacitor having a top and bottom electrode thereof and a ferroelectric dielectric layer therebetween. The ferroelectric dielectric layer comprises a first ferroelectric layer having a first crystallographic texture forming a main body of the dielectric layer and a second ferroelectric layer having a second differing crystallographic texture forming an interface layer between the main body and one of the top and bottom electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.