Semiconductor module and method of mounting
US6627997B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2000 |
| Grant date | Sep 30, 2003 |
| Priority date | — |
| Expiry date | Jan 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a multi-chip module, a plurality of semiconductor chips are mounted on a single wiring board. Upper surfaces of the semiconductor chips are covered with a single heat spread plate, and the whole space around the semiconductor chips, sandwiched between the wiring board and the heat spread plate, is filled with resin. The semiconductor chips are interconnected through the resin so that any stress exerted on any chips is dispersed. This diminishes the occurrence of cracks caused by stress concentration. Since the semiconductor chips and the heat spread plate are bonded together with resin, even if there are variations in size of the chips, both can be bonded easily. Further, the bonding of all the chips and the heat spread plate can be done in a single process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.