Substrate adhesion enhancement to film
US6629348B2 · kind B2 · utility
1Cited by
20References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2001 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Jul 24, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53804
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil is laminated to an etched surface of a polyimide substrate having a polyimide film thereon. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.