Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
US6629553B2 · kind B2 · utility
174Cited by
24References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2001 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Oct 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device mounting method and system and an IC card fabricating method which can fabricate high quality products by dicing a thin semiconductor wafer, in a state where it is adhered to an adhesive sheet, into thin semiconductor devices, peeling the group of diced thin semiconductor devices from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, conveying the group of peeled semiconductor devices on a unit basis in serial order, and mounting them onto a mounting board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.