Apparatus for grinding wafers using a grind chuck having a high elastic modulus
US6629876B1 · kind B1 · utility
6Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2000 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Feb 17, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for grinding wafers includes a grind chuck, formed of a soft material having a high elastic modulus, formed on a grind table. A grind unit grinds the wafer held by the grind chuck. Deionized water is supplied onto the wafer by a supply duct. A dam is formed on the grind table to surround the grind chuck, so that the wafer and the grind unit are submerged during grinding of the wafer. Also, an exhaust hole is formed through the grind table within an area surrounded by the dam, to exhaust the deionized water from the area surrounded by the dam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.