Resin sealing method and resin sealing apparatus
US6630374B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 11, 2001 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Jan 11, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame is placed on a lower mold with its non-mounting surface facing upward. An unused portion of a resin tape is supplied between the upper mold and the lower mold. The resin tape is sucked to the upper mold and preheated. A molten resin is injected into a cavity for curing, with the upper and lower molds closed together, and with the lead frame positioned loosely without being tightly clamped between the upper and lower molds. The injected resin presses the lead frame against the resin tape on the upper mold surface. Thus, resin sealing is performed. In this method, the resin tape is kept in close contact with the non-mounting surface of the lead frame and held in a space of the lead frame for resin sealing, so that formation of a cured resin on the bottom surface of the package can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.