Modularly expandable multi-layered semiconductor component
US6630727B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2000 |
| Grant date | Oct 7, 2003 |
| Priority date | — |
| Expiry date | Jan 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modularly expandable semiconductor component includes at least one carrier layer, at least one intermediate layer, at least one coverlayer, at least one semiconductor chip, external contacts and a conductor configuration. The intermediate layer is provided with at least one opening, into which the at least one semiconductor chip is inserted. The carrier layer, the intermediate layer and the coverlayer are connected one above another and form a submodule. If a plurality of submodules are installed above one another, a semiconductor component is provided in which the semiconductor chips are located in several mutually overlying planes. The semiconductor chips can be interconnected. A method for producing a semiconductor component is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.