Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards
US6632511B2 · kind B2 · utility
8Cited by
14References
65Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 9, 2001 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Nov 9, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2631
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to filled prepregs, laminates, printed circuit boards comprising a reinforcing material impregnated with a cured polymeric resin, the cured polymeric resin comprising multicellular polymeric microspheres as a filler. Pre-pregs, laminates and printed circuit boards prepared by this method have reduced dielectric constant as low as 3.0, depending upon the resin system of the matrix. In addition, such laminates and printed circuit boards have enhanced electrical, thermal and mechanical properties as well as improved machinability, low density and a uniform appearance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.