Patent · US Expired

Apparatus and method for determining various processes of wafer fabrication in a semiconductor device manufacturing technology

US6632685B2 · kind B2 · utility

0Cited by
3References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 28, 2001
Grant dateOct 14, 2003
Priority date
Expiry dateJul 29, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67294
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

According to the present invention, an apparatus for determining various processes of wafer fabrication suitable for a plurality of various processes of wafer fabrication, having: a plurality of wafer cassettes, each having a distinct transparency, used in the various processes of wafer fabrication; a sensor-set, used to detect the distinct transparency of each of the wafer cassettes, and output a signal corresponding to the distinct transparency; and an amplifier, connected to the sensor-set to receive the signal, thus reading the distinct transparency, so as to determine the type of the wafer cassettes. Furthermore, a method for determining various processes of wafer fabrication includes the steps of: providing a plurality of wafer cassettes, each having a distinct transparency, used in the various processes of wafer fabrication; reading the distinct transparency of each of the wafer cassettes; and determining the type of the wafer cassettes according to the distinct transparency.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.