Molded flip chip package
US6632704B2 · kind B2 · utility
17Cited by
12References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2000 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Dec 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a molded flip chip package is described. The incomplete flip chip package comprising a thin substrate and a silicon chip is placed in a mold. A resin, preferably epoxy, is injected into the mold filling the gap between the surface of the flip chip and the adjacent substrate. Additionally, a stiffening structure is formed to increase the overall rigidity of the thin substrate specifically and the package as a whole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.