Kinya Ichikawa
21Patents
9h-index
31Co-inventors
75Inventor score
Filing activity: Mar 29, 1996 → Feb 20, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7345361B2 | Stackable integrated circuit packaging | Electricity | 266 | Expired |
| US6020561A | Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof | Electricity | 113 | Expired |
| US9349703B2 | Method for making high density substrate interconnect using inkjet printing | Electricity | 86 | Active |
| US7132311B2 | Encapsulation of a stack of semiconductor dice | Electricity | 27 | Expired |
| US9741664B2 | High density substrate interconnect formed through inkjet printing | Electricity | 27 | Active |
| US5660321A | Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts | Electricity | 18 | Expired |
| US6632704B2 | Molded flip chip package | Electricity | 17 | Expired |
| US6838313B2 | Molded flip chip package | Electricity | 11 | Expired |
| US7495330B2 | Substrate connector for integrated circuit devices | Emerging Cross-Sectional Technologies | 10 | Active |
| US7132739B2 | Encapsulated stack of dice and support therefor | Electricity | 9 | Expired |
| US6342791B1 | Diode defect detecting device | Physics | 8 | Expired |
| US7097462B2 | Patch substrate for external connection | Emerging Cross-Sectional Technologies | 8 | Expired |
| US8110920B2 | In-package microelectronic apparatus, and methods of using same | Electricity | 6 | Active |
| US6785148B1 | Easy mount socket | Electricity | 5 | Expired |
| US5811883A | Design for flip chip joint pad/LGA pad | Electricity | 4 | Expired |
| US9502368B2 | Picture frame stiffeners for microelectronic packages | Electricity | 3 | Active |
| US9685388B2 | Picture frame stiffeners for microelectronic packages | Electricity | 1 | Active |
| US7005729B2 | Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame | Electricity | 1 | Expired |
| US9263329B2 | Methods of connecting a first electronic package to a second electronic package | Electricity | 0 | Active |
| US11362246B2 | Method of manufacturing display device with lateral wiring | Electricity | 0 | Active |
| US11410975B2 | Display device and method of manufacturing display device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.