Method of forming metallic z-interconnects for laminate chip packages and boards
US6634543B2 · kind B2 · utility
4Cited by
12References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2002 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Jan 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/096
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Deterioration and damage to insulator materials in an interconnection structure having vertical connections due to exposure to heat during bonding of lamina is avoided by performing diffusion bonding of metal pads at plated through holes (PTH) at temperatures below the melting points of conductive material in the bond. Diffusion bonding is achieved during time periods required for processing (e.g. curing or drying) of insulating materials in the laminated structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.