Brian E. Curcio
21Patents
7h-index
33Co-inventors
65Inventor score
Filing activity: Apr 12, 2001 → Jan 29, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6465084B1 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Emerging Cross-Sectional Technologies | 79 | Expired |
| US6452117B2 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | Emerging Cross-Sectional Technologies | 41 | Expired |
| US6638607B1 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6581280B2 | Method for filling high aspect ratio via holes in electronic substrates | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6504111B2 | Solid via layer to layer interconnect | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6645607B2 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6570102B2 | Structure for high speed printed wiring boards with multiple differential impedance-controlled layer | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6969436B2 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7076869B2 | Solid via layer to layer interconnect | Emerging Cross-Sectional Technologies | 5 | Expired |
| US8596746B2 | Inkjet pen/printhead with shipping fluid | Emerging Cross-Sectional Technologies | 4 | Active |
| US6634543B2 | Method of forming metallic z-interconnects for laminate chip packages and boards | Electricity | 4 | Expired |
| US6790305B2 | Method and structure for small pitch z-axis electrical interconnections | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7303639B2 | Method for producing Z-axis interconnection assembly of printed wiring board elements | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6955849B2 | Method and structure for small pitch z-axis electrical interconnections | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7914110B2 | Purging fluid from fluid-ejection nozzles by performing spit-wipe operations | Performing Operations; Transporting | 2 | Active |
| US7402254B2 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Emerging Cross-Sectional Technologies | 2 | Expired |
| US8474934B1 | Method for improving gloss of a print | Performing Operations; Transporting | 2 | Active |
| US8267498B1 | Methods, apparatus and articles of manufacture to control gloss quality | Electricity | 2 | Active |
| US6776852B2 | Process of removing holefill residue from a metallic surface of an electronic substrate | Emerging Cross-Sectional Technologies | 0 | Expired |
| US9798259B2 | Electrostatic ink compositions, methods and print substrates | Emerging Cross-Sectional Technologies | 0 | Active |
| US8356878B2 | Method of printing images | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.