Rapid surface cooling of solder droplets by flash evaporation
US6635101B2 · kind B2 · utility
7Cited by
11References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Aug 31, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0623
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A mist of liquid coolant is introduced into the path of atomized, molten, solder droplets. The mist and other conditions within the chamber are engineered to enable the liquid coolant droplets in the mist to contact the surfaces of molten solder droplets and be flash vaporized upon contact, thereby rapidly extracting heat from the molten solder droplets and accelerating cooling and solidification to produce an enhanced solder ball as a product of this process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.