Method of defining and forming membrane regions in a substrate for stencil or membrane marks
US6635389B1 · kind B1 · utility
1Cited by
11References
39Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 7, 2000 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Aug 2, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/22
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and structure for forming subfield regions includes mechanical definition of the substrate through machining or mold forming. The subfield regions are filled with a sacrificial layer before the thin membranes are deposited. Slots are mechanically machined through a substrate (the slots have dimensions of membrane subfields) and filled with a sacrificial material. The substrate is planarized. A membrane material is deposited over the substrate and patterned. The sacrificial layer is then removed. A mold can be utilized to form the slotted substrate in place of the machining operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.