Substrate dropping prevention mechanism and substrate inspection device provided therewith
US6635516B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 6, 2001 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Jul 11, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate inspection device for carrying out visual inspection of a front surface and a rear surface of a wafer W is provided with an arm 21 for holding the wafer W on pad mounting sections 21b through suction. The arm 21 is moved by an arm driving mechanism between a substrate conveying position and a substrate inspection position. The arm 21 is a flat plate partially cut away and having a bracelet-shape, while the pad mounting sections 21b are arranged at specified intervals on the surface of the arm 21. Clip members 24 are arranged at specified intervals on the arm 21 so as to prevent the wafer W dropping off from the arm 21. If the arm 21 is moved to the substrate inspection position, the clip members 24 move to a substrate dropping position. If the vacuum suction of the pad mounting sections 21b is impaired, the wafer W would drop off, but instead they come into contact with the clip members 24 and dropping is prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.