Method of measuring photoresist and bump misalignment
US6636313B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2002 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Mar 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method including the acts of providing a semiconductor device having a plurality of misalignment ruler markers formed therein for measuring removable layer opening misalignment in the X and Y directions, a bond pad and the passivation layer with an opening therein down to the bond pad. A removable layer is formed over the semiconductor device and includes an opening therein down to the bond pad. Preferably this action includes depositing, patterning and developing a dry photoresist film layer over the semiconductor device with an opening therein down to the bond pad. The next act includes measuring the misalignment of the opening in the passivation layer by counting the number of misalignment ruler markers visibly exposed by the opening in the X-direction and also the Y-direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.