Hsin-Hui Lee
57Patents
13h-index
57Co-inventors
87Inventor score
Filing activity: Aug 16, 2001 → Oct 8, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7361990B2 | Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads | Electricity | 119 | Expired |
| US6743660B2 | Method of making a wafer level chip scale package | Emerging Cross-Sectional Technologies | 72 | Expired |
| US7183137B2 | Method for dicing semiconductor wafers | Performing Operations; Transporting | 64 | Expired |
| US6756294B1 | Method for improving bump reliability for flip chip devices | Electricity | 30 | Expired |
| US7148560B2 | IC chip package structure and underfill process | Electricity | 28 | Expired |
| US7112882B2 | Structures and methods for heat dissipation of semiconductor integrated circuits | Electricity | 24 | Expired |
| US8039315B2 | Thermally enhanced wafer level package | Electricity | 21 | Active |
| US7265034B2 | Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade | Electricity | 19 | Expired |
| US6636313B2 | Method of measuring photoresist and bump misalignment | Electricity | 18 | Expired |
| US7294937B2 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Electricity | 16 | Active |
| US7126225B2 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Electricity | 16 | Expired |
| US6602775B1 | Method to improve reliability for flip-chip device for limiting pad design | Electricity | 13 | Expired |
| US6805279B2 | Fluxless bumping process using ions | Electricity | 13 | Expired |
| US9035445B2 | Seal ring structure with a metal pad | Electricity | 8 | Active |
| US7952167B2 | Scribe line layout design | Electricity | 8 | Active |
| US6974659B2 | Method of forming a solder ball using a thermally stable resinous protective layer | Electricity | 8 | Expired |
| US6715524B2 | DFR laminating and film removing system | Emerging Cross-Sectional Technologies | 7 | Expired |
| US8647963B2 | Structure and method of wafer level chip molded packaging | Electricity | 7 | Active |
| US7134199B2 | Fluxless bumping process | Emerging Cross-Sectional Technologies | 6 | Expired |
| US8497584B2 | Method to improve bump reliability for flip chip device | Electricity | 6 | Active |
| US8283754B2 | Seal ring structure with metal pad | Electricity | 5 | Active |
| US7906425B2 | Fluxless bumping process | Emerging Cross-Sectional Technologies | 4 | Active |
| US7468321B2 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Electricity | 4 | Active |
| US7154185B2 | Encapsulation method for SBGA | Electricity | 4 | Expired |
| US7075016B2 | Underfilling efficiency by modifying the substrate design of flip chips | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.