Wafer mapping apparatus and method
US6636626B1 · kind B1 · utility
6Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1999 |
| Grant date | Oct 21, 2003 |
| Priority date | — |
| Expiry date | Nov 30, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A wafer mapping system uses a camera to acquire an image of a carrier containing wafers. In one embodiment, the acquired image is stored as rows and columns of pixels. The presence and location of a wafer in the carrier are determined by looking for pixel intensity variations in a column of the image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.