Multi-material heat spreader
US6637506B2 · kind B2 · utility
10Cited by
12References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2002 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Mar 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In an embodiment, an apparatus for enhancing a thermal match between portions of a semiconductor device is disclosed. The apparatus includes a die and a heat spreader. The heat spreader is in thermal contact with the die. The heat spreader has a center portion and a perimeter portion. The center portion and the perimeter portions are structurally coupled to each other. In another embodiment, the perimeter portion of the heat spreader is selected from material with a lower CTE than the material for the center portion of the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.