Stable plating performance in copper electrochemical plating
US6638409B1 · kind B1 · utility
11Cited by
11References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2002 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | May 21, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A real-time and in-line process control system maintains stable plating performance in copper electrochemical plating IC devices by using a real time, on-line programmable controller. Two or more valves to direct the flow of the electrolyte from the electroplating cell back to the reservoir connect an alternative carbon-filter as well as a mirco-filter. The programmable controller controls the operation of at least two in-line valves to direct the flow of the electrolyte within the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.