Inventor · Tainan, TW

Hung-Jen Lin

34Patents
8h-index
51Co-inventors
78Inventor score

Filing activity: May 21, 2002 → Aug 23, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US8987922B2 Methods and apparatus for wafer level packaging Electricity 61 Active
US9564416B2 Package structures and methods of forming the same Electricity 18 Active
US11101209B2 Redistribution structures in semiconductor packages and methods of forming same Electricity 16 Active
US10026671B2 Substrate design for semiconductor packages and method of forming same Electricity 16 Active
US6774395B1 Apparatus and methods for characterizing floating body effects in SOI devices Electricity 16 Expired
US9059109B2 Package assembly and method of forming the same Electricity 12 Active
US6638409B1 Stable plating performance in copper electrochemical plating Chemistry; Metallurgy 11 Expired
US6777708B1 Apparatus and methods for determining floating body effects in SOI devices Physics 10 Expired
US9691723B2 Connector formation methods and packaged semiconductor devices Electricity 3 Active
US10074604B1 Integrated fan-out package and method of fabricating the same Electricity 3 Active
US9396973B2 Methods and apparatus for wafer level packaging Electricity 2 Active
US9673158B2 Formation of connectors without UBM Electricity 2 Active
US9859267B2 Package structures and methods of forming the same Electricity 1 Active
US9559071B2 Mechanisms for forming hybrid bonding structures with elongated bumps Electricity 1 Active
US10483132B2 Post-passivation interconnect structure and method of forming the same Electricity 1 Active
US8987605B2 Formation of connectors without UBM Electricity 1 Active
US11857282B2 Multi-segment rotation robotic arm Human Necessities 0 Active
US10728419B2 System and method using matrix barcode information to perform point-to-point information exchange Electricity 0 Active
US10896220B2 Method of searching an image file in a computer system, related image file searching device, and related computer system Physics 0 Active
US11394837B2 System and method using matrix barcode information to process documents Electricity 0 Active
US10163846B2 Mechanisms for forming hybrid bonding structures with elongated bumps Electricity 0 Active
US9935038B2 Semiconductor device packages and methods Electricity 0 Active
US10867957B2 Mechanisms for forming hybrid bonding structures with elongated bumps Electricity 0 Active
US10665565B2 Package assembly Electricity 0 Active
US10651055B2 Post-passivation interconnect structure and method of forming the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.