Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
US6638607B1 · kind B1 · utility
21Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2002 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Oct 30, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2804
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.