Copper foil excellent in laser beam drilling performance and production method therefor
US6638642B2 · kind B2 · utility
21Cited by
4References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2002 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Aug 19, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A copper foil with excellent laser drilling property, having a layer containing any one or more substances selected from indium, tin, cobalt, zinc, cobalt alloys, and nickel alloys on the face of the copper foil to be radiated with laser beams. A copper foil easy to be laser-processed and suitable for forming through hole and via hole with a small diameter at the time of manufacturing a printed circuit board and a method for manufacturing such a copper foil are achieved by improving the surface of a copper foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.