Method for determining, tracking and/or controlling processing based upon silicon characteristics
US6638778B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2002 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Feb 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is generally directed to various methods for determining, tracking and/or controlling processing based upon wafer characteristics. In one embodiment, the method is directed to selecting a plurality of wafers from the group of wafers based upon the semiconductor device to be manufactured on the wafer and at least one characteristic of the wafers. In another embodiment, the method comprises identifying a source of wafers wherein the device metrology data lies outside of the preselected range based upon the wafer identification mark and the device metrology data. As yet another example, the method comprises determining at least one parameter of a process operation to be performed on a wafer in a processing tool based upon the determined wafer characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.