Process for manufacturing a group comprising at least two elements, one whereof includes an encapsulated micro-integrated structure, and thereby obtained group
US6638836B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2000 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Oct 31, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/5552
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The manufacture process includes: forming a first wafer of semiconductor material housing integrated electronic components forming a microactuator control circuit and a signal preamplification circuit; forming microactuators, each including a rotor and a stator, in a surface portion of a second wafer of semiconductor material; attaching the second wafer to the first wafer, with the surface portion of the second wafer facing the first wafer; thinning the second wafer; attaching the second wafer to a third wafer to obtain a composite wafer; thinning the first wafer; cutting the composite wafer into a plurality of dice connected to a protection chip; removing the protection chip; attaching read/write transducers to the dice; and attaching the dice to supporting blocks for hard-disk drivers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.