Method for protecting the front side of semiconductor wafers
US6638837B1 · kind B1 · utility
5Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2002 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Sep 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of protecting the active surface, front side, of semiconductor wafers during the operations of backside grinding, transporting, and packaging has been achieved. The invention discloses a method for applying an organic passivation layer or an aqueous material for protection of the active components. These materials are easily removed prior to final packaging of the dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.