Fabrication of a hybrid integrated circuit device including an optoelectronic chip
US6640021B2 · kind B2 · utility
31Cited by
21References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2001 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Mar 22, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process is described for integrating an optoelectronic chip and a driver chip on a substrate, in which a waveguide is built into the substrate and the chips are joined to the substrate using a stud/via alignment technique. The waveguide structure includes a reflector and a channel for transmitting light emitted by the optoelectronic chip. A stud formed on the substrate is aligned to a via formed in a layer on the chip, aligning the chip so that the light reaches the reflector and enters the waveguide. A driver chip may be mounted on the substrate in close proximity to the optoelectronic chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.