Method for applying a fluid to a rotating silicon wafer surface
US6642155B1 · kind B1 · utility
8Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 1998 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Mar 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for applying conservative amounts of a fluid to coat a silicon wafer surface. The surface is rotated and the fluid is applied to the surface through multiple application ports. Centrifugal forces spread the fluid across the wafer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.