Techniques for joining an opto-electronic module to a semiconductor package
US6642613B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2001 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Sep 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a technique for manufacturing a low cost device that provides a true die to external fiber optic connection. Specifically, the present invention relates to several techniques for joining an optical device package to a semiconductor device package. The first technique involves using wirebond studs and an adhesive material, the second technique involves the use of an anisotropic conductive film, and the third technique involves the use of solder material. Each of these techniques provides high levels of thermal, electrical and optical performance. The methods apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.