Multi-chip package with embedded cooling element
US6643136B2 · kind B2 · utility
5Cited by
10References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 11, 2002 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Apr 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip package having one or more embedded cooling elements. The package includes a substrate, a plurality of chips, at least one cooling element, a plurality of solder balls and packaging material. The substrate has a front surface and a corresponding back surface. The chip is attached to the front surface of the substrate and electrically connected to the substrate. At least one cooling element is attached to the chips through thermal glue. The solder balls are attached to the back surface of the substrate. The packaging material encloses the substrate, the chips and the cooling elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.