Heat-dissipating device with grounding capability
US6643137B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2002 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Dec 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-dissipating device is adapted for use with a multi-layer circuit board having a grounding layer and that has an electronic component mounted thereon. The heat-dissipating device includes a heat-dissipating member, a grounding member and a connecting member. The heat-dissipating member is adapted to be disposed on a heat-radiating side of the electronic component. The grounding member includes a grounding tail and a grounding body connected to the grounding tail. The grounding tail is adapted to pass through the circuit board to connect electrically with the grounding layer and to dispose the grounding body between the heat-dissipating member and the circuit board. The connecting member interconnects the heat-dissipating member and the grounding member, and is adapted to be secured on the circuit board. The connecting member cooperates with the grounding member to make electrical connection between the heat-dissipating member and the grounding layer of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.