Yi-Chen Chung
8Patents
2h-index
11Co-inventors
44Inventor score
Filing activity: Dec 13, 2002 → May 3, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6643137B1 | Heat-dissipating device with grounding capability | Electricity | 15 | Expired |
| US8674365B2 | Array substrate and manufacturing method thereof | Electricity | 2 | Active |
| US8759165B2 | Manufacturing method of array substrate | Electricity | 1 | Active |
| US10276325B2 | Keyboard device | Electricity | 1 | Active |
| US8969146B2 | Array substrate and manufacturing method thereof | Electricity | 0 | Active |
| US9147700B2 | Manufacturing method of array substrate | Electricity | 0 | Active |
| US9263481B2 | Array substrate | Electricity | 0 | Active |
| US10020135B2 | Key structure and scissors-type connecting member thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.