Integrated device structure prediction based on model curvature
US6643616B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Dec 7, 1999 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Dec 7, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/36
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods and apparatuses for structure prediction based on model curvature are described. A simulation result corresponding to an integrated circuit or other structure is generated. The result includes contour data representing a feature value, for example, height (or intensity) of the structure at various points. Three or more points are used to determine a curvature of the result at a predetermined location. The curvature information can be used to determine boundaries of the structure. For example, when used with an integrated circuit layout, the curvature can be used for optical and process correction (OPC) purposes to modify an integrated circuit layout such that the resulting integrated circuit more closely resembles the designed integrated circuit than would otherwise be possible. In one embodiment, both slope and curvature of the integrated circuit structure are used for OPC purposes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.