Processes for manufacturing flexible wiring boards
US6643923B1 · kind B1 · utility
23Cited by
17References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Feb 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing a flexible wiring board according to the present invention includes growing metal bumps (16) using a mask film patterned by photolithography. Fine openings are formed in a polyimide film with good precision allowing fine metal bumps (16) to be formed with good precision. After metal bumps (16) have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.