Solder reflow with microwave energy
US6644536B2 · kind B2 · utility
31Cited by
13References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Dec 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.