Universal backplane assembly and methods

US6645344B2 · kind B2 · utility

Assignee

• TOKYO ELECTRON LIMITED · JP

Inventors

• Doug Caldwell · McKinney, US
• Albert Garcia · San Antonio, US
• Thomas J. Horback · Gilbert, US
• Michael J. Lombardi · Lake Zurich, US
• Mark McNicholas · Gilbert, US
• Dean Mize · Sachse, US
• Gon Wang · Gilbert, US

Key dates

• Filing date: May 18, 2001
• Grant date: Nov 11, 2003
• Expiry date: Nov 14, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68785
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A backplane assembly for a substrate processing system that is selectively configurable to provide an effective thermal contact with substrates of differing sizes. The backplane assembly includes a backplane base installed in a vacuum chamber of the substrate processing system and plural faceplates which are removably mountable to the backplane base. The backplane assembly is operable for regulating the temperature of the substrate and include elements that promote the efficient transfer of heat between the backplane base and the faceplate to perform the temperature regulation during processing. Each of the faceplates has a contact surface dimensioned and configured to engage a correspondingly dimensioned and/or configured type of substrate. The faceplates are readily demountable from the backplane base for exchange to accommodate a change in the dimension and/or configuration of the substrates being processed by the substrate processing system without removing the backplane base from the vacuum chamber.