Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sealing a chip and a reinforcing frame by transfer molding
US6645794B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2002 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Nov 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device manufacturing method in which a package including a semiconductor chip is mounted on a wiring board via tape ball grid array (TBGA), a tape base material having a device hole and a plurality of leads is provided with one end of the leads extended inside the device hole and a part of the other end of the leads forming lands for connecting bump electrodes. The semiconductor chip is arranged in the device hole of the tape base material to electrically connect the semiconductor chip and the one end of the leads. A sealing resin and reinforcing frame surrounding the periphery of the sealing resin are monolithically formed by transfer molding. The tape base material is fixed in an area between the semiconductor chip and the reinforcing frame by a lower mold and a projection of an upper mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.