Chuichi Miyazaki
42Patents
12h-index
58Co-inventors
84Inventor score
Filing activity: Mar 4, 1991 → Dec 14, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6521981B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US7420284B2 | Semiconductor device and manufacturing method thereof | Electricity | 29 | Active |
| US6114753A | Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6307269A | Semiconductor device with chip size package | Electricity | 25 | Expired |
| US7892949B2 | Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region | Electricity | 25 | Active |
| US6342726B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5141318A | Laser interferometer type length measuring apparatus and positioning method using the same | Physics | 19 | Expired |
| US6670215B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6342728B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6472727B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 17 | Expired |
| US7737001B2 | Semiconductor manufacturing method | Electricity | 17 | Active |
| US6433440B1 | Semiconductor device having a porous buffer layer for semiconductor device | Electricity | 12 | Expired |
| US6642083B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6365439B2 | Method of manufacturing a ball grid array type semiconductor package | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6791194B1 | Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same | Electricity | 10 | Expired |
| US7265035B2 | Semiconductor device and its manufacturing method | Electricity | 10 | Expired |
| US7148081B2 | Method of manufacturing a semiconductor device | Electricity | 9 | Expired |
| US6916686B2 | Method of manufacturing a semiconductor device | Electricity | 9 | Expired |
| US7091620B2 | Semiconductor device and manufacturing method thereof | Electricity | 8 | Expired |
| US6515371B2 | Semiconductor device with elastic structure and wiring | Electricity | 7 | Expired |
| US6355500B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 6 | Expired |
| US8883566B2 | Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure | Electricity | 4 | Active |
| US7759224B2 | Fabrication method of semiconductor integrated circuit device | Electricity | 3 | Active |
| US6353255B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7514294B2 | Semiconductor device and a manufacturing method of the same | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.