Silane containing polishing composition for CMP
US6646348B1 · kind B1 · utility
28Cited by
28References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2000 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Oct 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Polishing compositions comprising at least one soluble silane compound and at least one abrasive that are useful for polishing substrate surface features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.