Bump bonding unit with tray storage and transport apparatuses
US6647616B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1999 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Dec 15, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53317
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.